全部文献期刊学位论文会议报纸专利标准年鉴图书|学者科研项目
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作者:... Xiaoyan Li , Fangqiu Zu , Jiapeng Shui
来源:[J].Journal of Wuhan University of Technology-Mater. Sci. Ed.(IF 0.484), 2017, Vol.32 (6), pp.1476-1480Springer
摘要:The correlation between the internal friction behaviour of Zr55Al10Ni5Cu30 BMG samples and their quenching temperatures was investigated. It was found that, below the glass transition temperature, the activation energy decreased with in...
作者:... Yuan Yu , Chongjian Zhou , Fangqiu Zu
来源:[J].Journal of Wuhan University of Technology-Mater. Sci. Ed.(IF 0.484), 2018, Vol.33 (4), pp.797-801Springer
摘要:Abstract(#br)Bi 0.5 Sb 1.5 Te 3 /Cu core/shell powders were prepared by electroless plating and hydrogen reduction, and then sintered into bulk by spark plasma sintering. After electroless plating, with increasing the Cu content, the electrical conductivity keeps enhancing s...
作者:Xueting Dai , Zhongyue Huang , Fangqiu Zu
来源:[J].Journal of Wuhan University of Technology-Mater. Sci. Ed.(IF 0.484), 2019, Vol.34 (4), pp.840-844Springer
摘要:Abstract(#br)Bi 2 Te 2.7 Se 0.3 /Cu core/shell powders were prepared by electroless plating and hydrogen reduction, and then sintered into bulk by spark plasma sintering in order to improve the thermoelectric and mechanical properties of n -type Bi-Te thermoelectric material...
作者:... Hefa Cheng , Fangqiu Zu , Zhi-Gang Chen
来源:[J].Progress in Natural Science: Materials International(IF 0.989), 2018, Vol.28 (2), pp.218-224Elsevier
摘要:Abstract(#br)With the capacity of energy conversion from heat to electricity directly, thermoelectric materials have been considered as an alternative solution to global energy crisis. In this work, Cu modified Bi 0.5 Sb 1.5 Te 3 (BST) composites are prepared by a facile ele...
作者:... Yuan Yu , Chongjian Zhou , Fangqiu Zu
来源:[J].Scripta Materialia(IF 2.821), 2016, Vol.118, pp.19-23Elsevier
摘要:Abstract(#br)Copper coated Bi 0.5 Sb 1.5 Te 3 powders were prepared through electroless plating with simplified pretreatment method. After hydrogen reduction, the powders are consolidated into bulk by spark plasma sintering. The lowest lattice thermal conductivity in Bi 0.5 ...
作者:... Liang Li , Xiaoyun Li , Fangqiu Zu
来源:[J].Phase Transitions(IF 0.863), 2013, Vol.86 (4), pp.396-403Taylor & Francis
摘要:In order to study the structural relaxation of the Zr60Al15Ni25 amorphous ribbon, the electrical resistivity was experimentally investigated. The changes in the resistivity before glass transition temperature were observed. Two temperature points ...
作者:Fangqiu Zu , Wei Wu ...
来源:[J].Phase Transitions(IF 0.863), 2012, Vol.85 (12), pp.1091-1097Taylor & Francis
摘要:The liquid–liquid structure transition (LLST) as the function of temperature and time in Sn–3.5Ag–3.5Bi melts was investigated with the help of direct current four-probe method. The LLST which occurs during first cycle heating of two cycles heating/cooling experiments c...
作者:Fangqiu Zu , Zhongyue Huang ...
来源:[J].Phase Transitions(IF 0.863), 2012, Vol.85 (5), pp.453-460Taylor & Francis
摘要:This article reported the temperature dependence of the electrical resistivity ( ρ ) of liquid Sn–3.5Ag lead-free solder alloy in continuous heating and cooling processes with varying Bi content in the range of 0, 2, 3.5, 5, and 7 wt.% Abnormal transitions can be observed on...
作者:Fangqiu Zu , Wenlong Gao ...
来源:[J].Applied Surface Science(IF 2.112), 2012, Vol.258 (15), pp.5677-5682Elsevier
摘要:Abstract(#br)The effects of the melt state on the microstructure of Sn–3.5%Ag solder were investigated at two different cooling rates. The results show the solid–liquid interface energy is found to increase when the alloy is melted at above liquid–liquid structure trans...
作者:Fangqiu Zu , Zhongyue Huang ...
来源:[J].Journal of Materials Science: Materials in Electronics(IF 1.486), 2013, Vol.24 (4), pp.1231-1237Springer
摘要:Abstract(#br)The intermetallic compound (IMC) growth behavior of Sn–3.5Ag–3.5Bi/Cu joint was investigated with a change in the solder melt structure during soldering and 180 °C isothermal aging. The results show that when the solders undergo liqiud–liquid structure tran...

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