全部文献期刊学位论文会议报纸专利标准年鉴图书|学者科研项目
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作者:C.Y. Khor , F. Che Ani
来源:[J].Journal of Applied Fluid Mechanics(IF 0.263), 2016, Vol.9 (4), pp.2053-2062DOAJ
摘要:ABSTRACT This study investigated the effects of temperature on the wave soldering of printed circuit boards (PCBs) using three-dimensional finite volume analysis. A computational solder pot model consisting of a six-blade rotational propeller was developed and meshed using t...
作者:C.Y. Khor , W.K. Loh ...
来源:[J].Microelectronic Engineering(IF 1.224), 2014, Vol.113, pp.40-49Elsevier
摘要:Abstract(#br)This paper presents the effect of chip stacking in a 3D integrated circuit package during plastic encapsulation. An experiment was conducted on four stacked chips with bumps in a perimeter array. The flow front advancement and chip displacement in the experiment...
作者:C.Y. Khor , Norliza Binti Ibrahim
来源:[J].Computer Methods and Programs in Biomedicine(IF 1.555), 2019, Vol.180Elsevier
摘要:Abstract(#br)Obstructive sleep apnea is one of the most common breathing disorders. Undiagnosed sleep apnea is a hidden health crisis to the patient and it could raise the risk of heart diseases, high blood pressure, depression and diabetes. The throat muscle (i.e., tongue and so...
作者:C.Y. Khor , M.Z. Abdullah , F. Che Ani
来源:[J].Microelectronic Engineering(IF 1.224), 2011, Vol.88 (10), pp.3182-3194Elsevier
摘要:Abstract(#br)This paper presents the computational study of fluid/structure interaction (FSI) analysis in the molding process using the Mesh-based parallel Code Coupling Interface (MpCCI) method with finite volume coding (FLUENT 6.3) and finite element coding (ABAQUS 6.9). The FS...
作者:C.Y. Khor , M.Z. Abdullah ...
来源:[J].Microelectronics Reliability(IF 1.137), 2014, Vol.54 (8), pp.1511-1526Elsevier
摘要:Abstract(#br)The rapid development of computing software has facilitated multifarious research in integrated circuit (IC) packaging. Complicated and complex processes can be visualized via simulation modeling with this software. The applications of aided software enhance the...
作者:C.Y. Khor , M.Z. Abdullah ...
来源:[J].Microelectronics Reliability(IF 1.137), 2014, Vol.54 (4), pp.796-807Elsevier
摘要:Abstract(#br)This paper presents a fluid–structure interaction (FSI) analysis of ball grid array (BGA) package encapsulation. Real-time and simultaneous FSI analysis is conducted by using finite volume code (FLUENT) and finite element code (ABAQUS), which are coupled with Mp...
作者:... M.Z. Abdullah , C.Y. Khor , I.A. Azid
来源:[J].Simulation Modelling Practice and Theory(IF 1.159), 2015, Vol.57, pp.45-57Elsevier
摘要:Abstract(#br)This paper presents an optimization of pin through hole (PTH) connector in the wave soldering process; the optimization was performed by using response surface methodology. The geometrical and process parameters (i.e., offset position, pin diameter, offset angle...
作者:C.Y. Khor , A. Jalar
来源:[J].International Journal of Heat and Mass Transfer(IF 2.315), 2014, Vol.72, pp.400-410Elsevier
摘要:Abstract(#br)This paper presents an effective numerical method for evaluating the effect of the pin-through-hole (PTH) shape on the soldering stage using wave soldering technique. Three-dimensional finite volume numerical approach was employed to investigate capillary flow behavi...
作者:... M.Z. Abdullah , C.Y. Khor , A.A. Saad
来源:[J].International Journal of Heat and Mass Transfer(IF 2.315), 2015, Vol.87, pp.49-58Elsevier
摘要:Abstract(#br)This study presents the experimental and numerical analysis of the thermal process for laboratory scale desktop lead-free reflow oven and discusses a 3D CFD model of radiation heating with forced-air convection from circulating stainless steel fan. The experiments we...

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