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作者:Dasol Lee , Hyunseop Lee
来源:[J].Journal of Mechanical Science and Technology(IF 0.616), 2017, Vol.31 (12), pp.5705-5710Springer
摘要:Chemical mechanical polishing (CMP) is an essential process in semiconductor fabrication. The results of CMP process are determined with the selection of consumables and process parameters. The polishing pad transports the slurry to the interface between the polishing pad and ...
作者:Hyunseop Lee
来源:[J].International Journal of Precision Engineering and Manufacturing(IF 1.585), 2016, Vol.17 (4), pp.495-501Springer
摘要:Abstract(#br)Recently, a roll-type linear chemical mechanical polishing (Roll-CMP) process was developed for fabricating large flexible substrates such as flexible printed circuit boards (FPCBs). The major difference between the Roll-CMP and the conventional CMP is the type of co...
作者:Sukhoon Jeong , Sangjik Lee , Haedo Jeong
来源:[J].Microelectronic Engineering(IF 1.224), 2008, Vol.85 (11), pp.2236-2242Elsevier
摘要:Abstract(#br)Electro-chemical mechanical planarization (ECMP) process dissolves copper ions electrochemically by applying an anodic potential on the copper surface in an aqueous electrolyte, and then removes a copper (Cu) complex layer by the mechanical abrasion of a polishing pad...
作者:Urara Satake , Sena Harada , Toshiyuki Enomoto
来源:[J].Precision Engineering(IF 1.393), 2020, Vol.62, pp.30-39Elsevier
摘要:... Hence, there is a strong demand to prevent the deterioration in surface flatness near the wafer edge due to edge roll-off during polishing. In the present study, we investigate the viscoelastic behavior of polishing pads and its effects on the uniformity of material removal d...
作者:Jun Li , Junyang Huang , Chengxu Hua ...
来源:[J].The International Journal of Advanced Manufacturing Technology(IF 1.205), 2019, Vol.103 (9-12), pp.4795-4803Springer
摘要:... Surface pattern of a polishing pad is one of the main factors to control the flow of slurry. To achieve the slurry uniform flow, the hydrodynamics of the slurry were calculated to design the surface grooves on polishing pad. Finite element technology was adopted to simulate t...
作者:Sukhoon Jeong , Sangjik Lee , Boumyoung Park ...
来源:[J].Current Applied Physics(IF 1.814), 2009, Vol.10 (1), pp.299-304Elsevier
摘要:... That is, this technique involves both electrochemical plating and mechanical sweeping of the material surface by the polishing pad. The mechanism of the ECMD process may be achieved through two mechanisms. The first mechanism may be the electrochemical plating on the surface ...
作者:Yongsong Xie , Bharat Bhushan
来源:[J].Wear(IF 1.262), 1996, Vol.200 (1), pp.281-295Elsevier
摘要:Abstract(#br)The objective of this research is to better understand the mechanisms of material removal in the free abrasive polishing process. Experiments were carried out to understand the effects of particle size, polishing pad and nominal contact pressure on the wear rate and ...
作者:John McGrath , Chris Davis
来源:[J].Journal of Materials Processing Tech.(IF 1.953), 2004, Vol.153-154, pp.666-673Elsevier
摘要:Abstract(#br)Chemical mechanical planarisation (CMP) is a polishing process used in the fabrication of silicon wafers to achieve a globally planar wafer surface. The removal of material from the wafer is dependant upon the surface properties of the polishing pad along with other ...
作者:Sung-Lin Tsai , Yao-Ching Tsai , Jiuan-Huang Ke ...
来源:[J].Materials and Manufacturing Processes(IF 1.297), 2011, Vol.26 (5), pp.713-721Taylor & Francis
摘要:Polishing pads are precision polishing tools for flattening workpieces. The conventional two-dimensional aperture structured polishing pads not only wear out fast with the polishing process but also lead to poor surface quality when the polishing wastes fill the apertures and...
作者:Pei-Lum Tso , Shuo-Young Ho
来源:[J].The International Journal of Advanced Manufacturing Technology(IF 1.205), 2007, Vol.33 (7-8), pp.720-724Springer
摘要:Abstract(#br)The primary consumables in the chemical mechanical polishing (CMP) process are the polishing pad and the slurry. Among those consumables, the polishing pad significantly influences the stability of the process and the cost of consumables (CoC). Furthermore, the small...

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