Gruppo Italiano Frattura
期刊
会议
图书
作者:Jan Mehner , Detlef Billep
来源:[J].Fracture and Structural Integrity, 2011, Vol.5 (15), pp.21 - 28
摘要:Wafer bonding describes all technologies for joining two or more substrates directly or using certain intermediate layers. Current investigations are focused on so_called low temperature bonding as a special direct bonding technology. It is carried out without intermediate layers...

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